Manufacturing & Supply ChainYears of innovation,
unified into one platform.
Mythic's manufacturing advantage goes beyond the chip itself. Our vertically integrated platform combines proprietary analog compute IP, 3D hybrid bond technology, advanced digital logic, and a unified software stack into one cohesive architecture. Individual components might be replicated, but the complete platform cannot be reproduced without the more than 50 patents we have across every layer of the stack.
the MYTHIC Vanguard PlatformThe architecture that changes the equation.
Mythic's Vanguard Platform delivers 120 TOPS per watt through four purpose-built layers that work together as one system, achieving higher performance, improved energy efficiency, and a scalable, cost-effective business model through vertical integration.
The MYTHIC DIFFERENCEFour purpose-built layers.
Foundry & Chiplet supply ChainA global network built for scalable, cost-effective chiplet production.
Mythic's supply chain brings together the world's leading foundry and packaging partners, selected for both capability and the ability to scale alongside the platform.
Wafer Fabrication
28nm
A leading multinational foundry providing mature-to-mid-node manufacturing at 28nm and 12nm across global fabs.
5nm
The world's leading pure-play semiconductor foundry, delivering advanced logic manufacturing at N3 and N5 nodes at scale alongside mature nodes.
Test & packaging
Packaging
The world's largest outsourced semiconductor assembly and test provider, delivering advanced packaging, wafer probing, and high-volume manufacturing and heterogeneous integration solutions.
Packaging
A FO-WLP innovator providing M-Series FO-WLP and Adaptive Patterning technology, licensed to major OSATs for high-density packaging and chiplet solutions.
Test/Assembly
A leading test and product-engineering provider with strong probe, test, and package-design capabilities across global labs.
Packaging
A US-based advanced-packaging and microelectronics manufacturing facility focused on heterogeneous integration and 2.5D/3D packaging.
supply Chain flowsWafer-to-Wafer (W2W) supply chain flow.
Die-to-Wafer (D2W) supply chain flow.
Why it MattersThe architecture
is the advantage.
Mythic's competitive advantage extends beyond advanced semiconductor nodes. The vertically integrated combination of analog compute, digital logic, 3D hybrid bond technology, advanced packaging, and software integration creates a platform that is greater than the sum of its parts.
The result: higher performance per watt, with a manufacturing model designed for cost-efficient scale.